1. 2. 3. material content data sheet sales product name bts50080-1tmc issued 29. august 2013 ma# MA001044082 package pg-to220-7-4 weight* 1525.59 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.391 0.42 0.42 4189 4189 leadframe non noble metal iron 7439-89-6 0.910 0.06 597 inorganic material phosphorus 7723-14-0 0.273 0.02 179 non noble metal copper 7440-50-8 909.052 59.58 59.66 595867 596644 wire non noble metal aluminium 7429-90-5 0.911 0.06 0.06 597 597 encapsulation organic material carbon black 1333-86-4 8.875 0.58 5818 plastics epoxy resin - 97.628 6.40 63994 inorganic material silicondioxide 60676-86-0 485.182 31.80 38.78 318029 387841 leadfinish non noble metal tin 7440-31-5 12.090 0.79 0.79 7925 7925 plating non noble metal nickel 7440-02-0 0.216 0.01 141 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 141 glue plastics polyimide 26023-21-2 0.143 0.01 0.01 93 93 solder noble metal silver 7440-22-4 0.098 0.01 64 non noble metal tin 7440-31-5 0.078 0.01 51 non noble metal lead 7439-92-1 3.746 0.25 0.27 2455 2570 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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